XMC ship 100 million backside illumination image sensors
XMC, a little known company in tech world is infact one of the leading 300mm semiconductor manufacturing cmpany. Today, XMC has announced that they have shipped more than 100 million Backside Illumination (BSI) CMOS Image Sensor (CIS) units. All their units are used for camera modules with sensors ranging from 5mp to 23mp resolution. Also, the new 3D wafer stacking tech developed by XMC for BIS CIS has now entered volume production.
“With the offering of the advanced wafer stacking technology, XMC enables its partners to enlarge the share of high-end CIS market,” Dr. Shaoning Mei, CTO at XMC said, “We will further enhance our 3D IC expertise on the basis of 3D wafer stacking technology, by which we can achieve high performance and low power through directly connecting the core parts of two chips. 3D IC is expected to be an important technology to keep us on track with Moore’s Law. It is also the key strength for XMC to establish its leadership in 3D IC industry.”
