Intel and Rockchip release XMM6321 3G SoC for Android devices
Earlier this year, Intel and Rockchip announced collaboration to jointly develop new system-on-a-chip processors. This week, Intel/Rockchip announced availability of XMM6321 SoC that combines XG632 CPU+GPU chip based on ARM Cortex dual-core CPU and AG620 chip designed by Intel/Infineon. The new SoC includes 2G/3G RF, Wi-Fi, BLuetooth, GPS/GLNOASS, audio/PMU. The new SoC is meant for entry-level smartphones. It is indeed interesting to see a product from Intel that is using ARM’s chip instead of their own Atom chip. XMM6321 is available from this week for North American markets.
“Rockchip’s strength lies in the ability to develop tightly integrated, reliable SoC platforms and this collaboration with Intel is testament to this strength,” said Yanyan Xing, Brand Manager, Rockchip. “It has yielded a solution that requires the fewest separate processor functions compared to competing solutions. It provides low power consumption and a low cost to adopt. Also, it is turnkey to allow really fast times to market. The XMM6321 significantly reduces 3G device product costs which can significantly reduce market prices for these devices. This new Rockchip SoC will be a cornerstone for new levels of global 3G product popularization.”
Key specification
- 1GHz speed (can be overclocked to 1.2GHz)
- Open GL ES 2.0;
- LPDDR2 666 MT/s eMMC 4.41
- display support for MIPI-DSI 854×480 @ 60 fps or 1024×600 @ >30 fps
- H.264, VP8 @ 1080p30 video decoding, H.264 @ 720p24 video encoding
- camera support for MIPI CSI-2 2+1 lanes / up to 8MP rear + 3MP front
- Android OS : KitKat or higher
- integrated Rel-7 HSPA+ 21/5.8, GSM, GPRS, EDGE, and DSDS with DvP
- 802.11 b/g/n Wi-Fi
- Bluetooth v4.0 LE
